Fault tolerant memory systems and components with interconnected and redundant data interfaces

ABSTRACT

A memory system includes dynamic random-access memory (DRAM) components that include interconnected and redundant component data interfaces. The redundant interfaces facilitate memory interconnect topologies that accommodate considerably more DRAM components per memory channel than do traditional memory systems, and thus offer considerably more memory capacity per channel, without concomitant reductions in signaling speeds. The memory components can be configured to route data around defective data connections to maintain full capacity and continue to support memory transactions.

BACKGROUND

Personal computers, workstations, and servers are general-purposedevices that can be programmed to automatically carry out arithmetic orlogical operations. These devices include at least one processor, suchas a central processing unit (CPU), and some form of memory system. Theprocessor executes instructions and manipulates data stored in thememory.

Memory systems commonly include a memory controller that communicateswith some number of memory modules via multi-wire physical connectionscalled “channels.” Each memory module commonly includes dynamic randomaccess memory (DRAM) components mounted on a printed circuit board.Successive generations of DRAM components have benefitted from steadilyshrinking lithographic feature sizes. Storage capacity and signalingrates have improved as a result.

One metric of memory-system design that has not shown comparableimprovement is the number of modules one can connect to a singlechannel. Adding a module to a channel increases the “load” on thatchannel, and thus degrades signaling integrity and limits signalingrates. The number of modules per memory channel has thus eroded withincreased signaling rates. There is therefore a demand for increasedmodule counts per channel.

Reliability is another important metric of memory-system design, and canbe characterized in terms of mean time between failures. Addingcomplexity, such as additional modules per channel, increases the numberof elements that might fail. Reliability can be improved by carefulengineering, and modern computer systems are a testament to that care.Hardware faults remain a possibility, however. The most reliable systemsdetect and manage these and other problems. There nevertheless remains aneed for ever more reliable systems.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 depicts a DRAM component 100 that includes redundant andinterconnected first and second component data interfaces 105 a and 105b.

FIG. 2 depicts a DRAM package 200—also called a DRAM “stack”—comprisedof two DRAM components 100 a and 100 b, each an instance of DRAMcomponent 100 of FIG. 1.

FIG. 3A depicts a portion of a memory module 300 upon which is mountedan embodiment of DRAM package 200 of FIG. 2.

FIGS. 3B-3H depict respective modules 300B-300H, packaging alternativesthat can provide connectivity to DRAM components that is functionallyequivalent module 300 of FIG. 3A.

FIG. 4 depicts a memory module 400 in accordance with an embodiment thatincludes nine collections 405[8:0] of DRAM packages, each collectionincluding a pair of front-side DRAM packages 200A and a pair of backsideDRAM packages 200B.

FIG. 5A depicts a memory system 500 in which two memory modules 505 xand 505 y, each configured in a ×36 mode, communicate ×72 data with acontroller component 510.

FIG. 5B is a timing diagram detailing a read transaction for system 500of FIG. 5A. The “x” and “y” designations on modules 505 match theconnections of the primary CA buses CAx and CAy.

FIG. 5C depicts a memory system 520 similar to system 500 of FIGS. 5Aand 5B but with one module 505 y and a continuity module 525 x.

FIG. 5D is a timing diagram detailing a read transaction for system 500of FIG. 5C.

FIG. 5E depicts system 500 of FIG. 5A but illustrates how the interfacelogic can accommodate direct transfers between two DRAM components onthe same module.

FIG. 5F shows the waveforms of the various CA and DQ links, and alsoindicates the nominal signaling rate of those buses in accordance withone embodiment.

FIG. 5G depicts system 500 of FIG. 5A but illustrates how the interfacelogic can accommodate direct data transfers between DRAM components ondifferent modules.

FIG. 5H shows the waveforms of the various CA and DQ buses, and alsoindicates the nominal signaling rate of those buses in accordance withone embodiment.

FIG. 5I depicts system 500 of FIG. 5A but illustrates how interfaces 105on components 100 provide routing options that allow modules 505 toroute read and write data around defective data paths DQu.

FIG. 5J is a timing diagram detailing a read transaction for system 500of FIG. 5I.

FIG. 5K is similar to FIG. 5I, illustrating how data can be routed toand from DRAM components 100 xa and 100 yb via primary link group DQv ina DQu-fault mode.

FIGS. 5L and 5M are similar to FIGS. 5I and 5J, but illustrate howinterfaces 105 can route read and write data around a faulty primarylink group DQv in a DQv-fault mode.

FIG. 5N illustrates how data can be routed to and from DRAM components100 xa and 100 yb via primary link group DQu in the DQv-fault mode.

FIG. 6A is a diagram 650 depicting elements of interfaces 105 a and 105b that establish a communication path from port DQa to port DQb.

FIG. 6B shows the timing relationship of elements of diagram 650 of FIG.6A.

FIG. 6C shows the second order detail of the domain-crossing logic forthe circuitry of diagram 650 of FIG. 6A.

FIG. 6D is similar to FIG. 6C, except that it assumes the DQS_(IN) andCK signals are not aligned so the SKP[1] value sampled from CK+90° byDQS_(IN) is high.

FIG. 6E is a waveform diagram illustrating how the timing examples ofFIGS. 6C and 6D can be combined to automatically track drift between theDQSI_(N) and CK domain over an arbitrarily large range.

DETAILED DESCRIPTION

FIG. 1 depicts a dual-port DRAM component 100 that includes redundantand interconnected first and second component data interfaces 105 a and105 b serving respective data ports DQa and DQb. The redundantinterfaces 105 a and 105 b facilitate memory interconnect topologiesthat accommodate considerably more DRAM components per memory channelthan do traditional memory systems, and thus offer considerably morememory capacity per channel, without concomitant reductions in signalingspeeds. Interfaces 105 a and 105 b also support flexible routing optionsthat allow memory systems to route around defective data paths. Suchalternative routing can reduce system speed performance, but maintainsfull capacity while allowing time for repair.

A multiplexer 110 allows either of data interfaces 105 a and 105 b towrite data to a memory bank or banks 115 via a configurable delayelement 120. Multiplexers 125, one in each of interfaces 105 a and 105b, selectively convey read data from memory bank 115 to a respectivedata port DQa or DQb. Multiplexers 125 also allow component 100 to relaywrite and read data to and from other components 100, bypassing thelocal bank 115. Delay element 120 can impose selected read/write delaysto align read and write transactions from and to disparate DRAMcomponents 100.

Each of data ports DQa and DQb conveys nibbles of data, where a nibbleis four bits. Each port includes six conductors, however, as two areused to communicate differential strobe signals DQSa± and DQSb± thatserve as timing references for the accompanying data signals. Acommand/address interface CA conveys control signals (e.g. command,addresses, and chip-select signals) to CA logic 135, which managesmemory transactions with banks 115 and controls the states ofmultiplexers 110 and 125.

DRAM component 100 includes one integrated circuit (IC) memory die inthis example. In other embodiments, however, DRAM component 100 caninclude a “master die” with the type of circuitry shown here withadditional DRAM dies stacked and interconnected with the master dieusing e.g. through-silicon vias (TSVs) for the die data and controlinterfaces. In one example, component 100 can include a stack of e.g.eight DRAM die that can be independently chip-selected by CA logic 130.Alternatively, all or some of the functionality provided by interfaces105 a/105 b, multiplexer 110, delay element 120, and CA logic 130 can beprovided by a separate buffer component.

FIG. 2 depicts a DRAM package 200—also called a DRAM “stack”—comprisedof two DRAM components 100 a and 100 b, each an instance of DRAMcomponent 100 of FIG. 1. The term “package” refers here both to aprotective case and one or more IC dies or components enveloped withinthat case. Element names for components of DRAM components 100 end witha lower-case letters where needed distinguish between them. For example,interfaces CAa and CAb are coupled in parallel such that memory package200 includes a command/address port CAab common to both components 100a/100 b.

DRAM package 200 can include more or fewer components in otherembodiments.

The first memory component 100 a includes first and second componentdata ports DQa and DQb as described in connection with FIG. 1. Thesecond memory component 100 b includes similar third and fourthcomponent data ports DQc and DQd. Component data ports DQb and DQd areinterconnected to create a common package data port DQbd, and thus allowdata to be conveyed directly between components 100 a and 100 b. Dataports DQa and DQc remain separate so that DRAM package 200 includesthree nibble-wide package data ports DQa, DQc, and DQbd that areaccessible via a package connector 205. As noted previously, each ofthese data ports conveys four bits of data (a nibble) and a differentialstrobe signal, for a total of six conductors. The strobe signals areomitted here for ease of illustration.

FIG. 3A depicts a portion of a memory module 300, a printed-circuitboard (PCB) upon which is mounted an embodiment of DRAM package 200 ofFIG. 2. Package 200 includes two sub-packages 302 a and 302 b withrespective package substrates 305 a and 305 b wired to provide theconnectivity illustrated in FIG. 2. Large connection balls 307 on thebottom of substrate 305 a couple to pads on the top of substrate 305 b.Similarly, the large connection balls on the bottom of substrate 305 bserve as the package connector to couple to pads on a module substrate310, e.g., a printed-circuit board. (Different types of package andsub-package connectors can be used, some of which are depicted in FIGS.3B-3H.)

Both substrates 305 a and 305 b provide the same wiring patterns. Aconductive trace 303 connects each (large) package connection ball 307to a small connection ball (e.g. a C4 ball 309) on one of DRAMcomponents 100 a and 100 b. On the right side of the package substrate,each connection ball 307 is coupled with the connection pad 311 directlyabove it. This forms a point-to-two-point (P-to-2P) connection topologyfor both data ports DQb and DQd. The same P-to-2P topology is used forCA ports CAa and CAb, but this detail is omitted here. The left sides ofsubstrates 305 a and 305 b are different from the right; each connectionball is coupled with the connection pad above it and shifted oneposition to the right. These shifts form point-to-point (P-to-P)connection topologies for each of ports DQb and DQd.

FIGS. 3B-3H depict respective modules 300B-300H, packaging alternativesthat can provide connectivity to DRAM components that is functionallyequivalent module 300 of FIG. 3A. Modules 300B-300H can be customized toallow a mix of P-to-2p and P-to-P link topologies to be used by two DRAMcomponents 100 a and 100 b. As detailed below, these topologies allowthe second DQ interface on each DRAM component to be used to improve thecapacity range and the performance of the system.

In FIG. 3H, component 100 b supports center-stripe input/output pads 345that connect to conductors within a module substrate 350 via wire bondsthat extend through a window in the substrate. Component 100 a is edgebonded to module substrate 350. Through-silicon vias (TSVs) 355 can beincluded to communicate signals between components 100 a and 100 b.

FIG. 4 depicts a memory module 400 in accordance with an embodiment thatincludes nine collections 405[8:0] of DRAM packages, each collectionincluding a pair of front-side DRAM packages 200A and a pair of backsideDRAM packages 200B. Each package 200A/200B includes two DRAM components100 a and 100 b, so each collection 405[#] includes eight, and module400 includes seventy-two. Examples of DRAM components 100 a/100 b andDRAM packages 200A/200B are detailed above in connection with respectiveFIGS. 1 and 2. The top of FIG. 4 depicts a side-view of one manner ofmounting four packages, a pair of packages 200Au and 200Av on the frontside of module 400 and a pair of packages 200Bu and 200Bv on the back.Each package 200 is as described in connection with FIGS. 2 and 3A. Thefront view of FIG. 4 illustrates both the package control and packagedata connections; the side view omits the control connections.

Module 400 includes a module connector 410 and an address buffercomponent 415. (Buffer component 415 is sometimes called a Registered orRegistering Clock Driver, or RCD.) Module connector 410 providesexternal connectivity to a set of primary data connections 420 andprimary control connections 425. In this context, “primary” connectionsare external to modules 400, and “secondary” connections are within.

Primary data connections 420 connect the package data interface of eachof DRAM collections 405[8:0] to a corresponding pair of link groupsDQu/DQv, each link group conveying four bits of data DQ and adifferential strobe DQS±. Control connections 425 connect buffercomponent 415 to a primary command/address link group DCA and primarycontrol link group DCTRL. As detailed below, buffer component 415interprets command, address, and control signals on connections 425 tocreate and issue secondary command, address, and control signals to DRAMcollections 405[8:0] via secondary link groups CAxa and CAxb. As usedherein, a “link” is a conductor that provides a unidirectional orbidirectional communication between source and destination circuits, anda “link group” is a collection of links that communicates between sourceand destination circuits in parallel.

With reference to DRAM collection 405[4]—the others are identical—nibbleDQu is coupled to input port DQa of the left front-side package 200Au,and nibble DQv is coupled to input port DQa of the right front-sidepackage 200Av. The internal interconnectivity for each package 200 is asillustrated in FIGS. 1 and 2. All four packages 200 can be written toand read from via either of nibble-wide link groups DQu and DQv.

Module 400 supports different data widths. In a wide-data mode, eachDRAM collection 405[8:0] communicates 8-bit-wide (×8, or “by eight”)data as two nibbles DQv and DQu, for a total module width of 9×8=72bits. In a narrow-data mode, each DRAM collection 405[8:0] communicates4-bit-wide (×4) data as one of nibbles DQv and DQu, for a total modulewidth of 9×4=36 bits. In either mode, data to and from packages 200Buand 200Bv traverses respective packages 200Au and 200Av, which imposeadditional write and read delays. Delay elements 120 (FIG. 1) inpackages 200Au and 200Av can insert delays that normalize the latenciesfor memory transactions to the different packages.

FIG. 5A depicts a memory system 500 in which a motherboard 502 supportstwo memory modules 505 x and 505 y, each configured in a ×36 mode,communicate ×72 data with a controller component 510. Motherboard 502,alternatively known as the mainboard or system board, is aprinted-circuit board (PCB) commonly found in computers with expandablememory systems. Motherboard 502 supports and facilitates communicationbetween electronic components and provides connections for peripheraldevices.

Modules 505 x and 505 y are as detailed previously, each including apair of DRAM components 100 interconnected physically and electricallyinto a single package 200 (e.g., like package 200 of FIG. 2). Eachmodule 505 includes nine such pairs, but eight are omitted for ease ofillustration. Modules 505 x and 505 y are similar or identical, withtheir respective and identical packages and components distinguishedusing a terminating “x” or “y”.

DRAM components 100 in each DRAM package 200 includes data interfaces105 that route data to and from memory banks 115, and between DRAMcomponents 100. The four data interfaces 105 in each package 200 x,collectively a package interface 507 x, allow the respective module 505x to communicate data from either DRAM component 100 xa or 100 xbthrough either of two module data ports, one associated with each ofports DQxa and DQxc. Port DQxa is coupled to controller component 510via a primary link group DQu, and port DQxc to module 505 y via aprimary link group DQt that is electrically isolated from controllercomponent 510. A package data interface 507 y likewise allows module 505y to communicate data from either DRAM component 100 ya or 100 ybthrough either of two module data ports associated with ports DQya andDQyc. Port DQya is coupled to controller component 510 via a primarylink group DQv, and port DQyc to module 505 x via a primary link groupDQt. The routing flexibility provided by package data interfaces 507 xand 507 y supports point-to-point data connections with differentnumbers of modules, and also allows system 500 to reroute data arounddefective links and link groups.

FIG. 5B is a timing diagram detailing a read transaction for system 500of FIG. 5A. The “x” and “y” designations on modules 505 match theconnections of the primary CA buses CAx and CAy. Controller component510 can be a dedicated memory controller, or can include support foradditional functionality. A column at the right indicates the nominalsignaling rate of the various buses for an embodiment in which theprimary DQ signaling rate is 6.4 Gb/s. The relative signaling rate ofthe buses can scale up or down with the primary DQ rate. Each of the tworead transactions includes an activate command (labeled “A” or “ACT”), aread command (labeled “R” or “RD”), and read data (labeled “36×16b”).The commands and data for each transaction are pipelined. This meansthat they occupy fixed timing positions with respect to thetransactions, and that the transactions overlap other transactions. Thetiming intervals that are used are shorter than what might be consideredtypical at present. For example, the ACT to RD command spacing (tRCD) isshown as 6.25 ns, but would more commonly be about 12.5 ns. Thiscompression of the timing scale is done for clarity, and does not affectthe technical accuracy; the pipeline timing works equally well with atRCD delay of 6.25 ns.

The tBUF-CA interval (0.93 ns) is the propagation delay needed by buffercomponents 415 to retransmit the information on the primary CA links CAxand CAy to the secondary CA links CAxa/CAxb and CAya/CAyb. The tRLinterval (3.125 ns) is the column read delay between the RD command andthe read data needed by the DRAM. The tBUF-DQ (0.93 ns) interval is thepropagation delay needed by the DRAM on module 505 x to retransmit theinformation on the secondary links DQxa and DQxc links to primary linkgroup DQu. This is because DRAM component 100 xb lacks a directconnection to controller component 510.

The access on module 505 y has a configurable delay (tBUF-DQ) insertedin its read access so that the read data is returned to the controlleron primary link groups DQu and DQv at approximately the same time. Thisincremental delay makes it easier for the controller to manage thememory pipeline. The diagram for write transactions would be similar,but with different fixed timing positions of commands and data.

The transaction granularity that is shown is 72 bytes, or 72 bits withan eight-bit burst length. There are enough command slots to allow eachtime slot of primary links DQu and DQv to be filled with data. Eachtransaction performs a random row activation and column access on each72 bytes (“36×16b”). Other transaction granularities are possible. Notethat there are 576 bits forming each 72-byte transfer block. Eachtransfer block communicates 64 bytes of data with an extra eight bytesto allow for the transfer and storage of a checksum for an EDC (errordetection and correction) code.

If there are bank conflicts in the transaction stream, and if thetransaction stream switches between read and write operations, then dataslots are skipped. This form of bandwidth inefficiency is typical ofmemory systems. No additional resource conflicts are introduced by themodifications that have been made to this improved memory system.

The “x” and “y” transactions begin with an activation command “A” on theCAx and CAx buses. These buses have a point-to-point topology and asignaling rate of 1.6 GB/s (one-quarter the signaling rate of thepoint-to-point DQ buses).

Buffer components 415 x and 415 y each receives the primary CA bus andretransmits the information on secondary buses CAxa/CAxb and CAya/DQyb.The secondary CA buses operate at 0.8 Gb/s, half the speed of theprimary CA buses and ⅛th the speed of the primary DQ buses. This isbecause the module CA buses have a multi-drop topology; each of themodule CA buses connects to half of the DRAM components on the module.The “x” and “y” transactions continue with a read command “R” on the CAxand CAy buses, which is retransmitted on secondary buses CAxb and CAya.

The two read transactions access two of the four dual-port DRAMcomponents, components 100 ya and 100 xb in this example. The “x”transaction accesses component 100 xb, which means that the read datawill be driven onto secondary links DQxbd to the upper DRAM component100 xa and then conveyed to controller component 510 on primary linksDQu. The “y” transaction accesses component 100 ya, which drives theread data onto primary links DQv. An incremental delay is added to the“y” transaction so the read data on primary links DQu and DQv arrive atcontroller component 510 at approximately the same time. In thisexample, the delay to retransmit from secondary links DQxbd to primarylinks DQu is approximately three clock cycles (about one nanosecond).This example provides one cycle for serialization latency (two data bitsper clock cycle) plus two additional clock cycles for clock skew betweenthe two DRAM components (±1 clock cycle). The other DRAM components inthe four DRAM component set would be accessed with a high order addressbit set differently in the CAx and CAy commands. Primary link group DQtis not used; the interface circuitry on the DRAM components connected tothis bus will typically be disabled by e.g. a control register field.

FIG. 5C depicts a memory system 520 similar to system 500 of FIGS. 5Aand 5B but with one module 505 y and a continuity module 525 x.Continuity module 525 x connects link group DQu to link group DQt; eachof the four DQ links and the two DQS links is connected with acontrolled impedance wire that matches (approximately) the impedance ofthe motherboard wires of the data link groups. The CAx bus is notconnected to anything on the continuity module.

FIG. 5D is a timing diagram detailing a read transaction for system 500of FIG. 5C. As with the example of FIG. 5B, this diagram indicates thenominal signaling rate of the various buses, assuming that the primaryDQ signaling rate is 6.4 Gb/s. Each of two read transactions includes anactivate command (labeled “A” or “ACT”), a read command (labeled “R” or“RD”), and read data (labeled “36×16b”). The commands and data for eachtransaction are pipelined. This means that they occupy fixed timingpositions with respect to the transaction, and it also means that thetransactions overlap other transactions.

The fixed timing positions may be shifted slightly from the positions inother configurations. This shifting will not cause a scheduling problemfor controller component 510 because these configurations are static;e.g. the configuration is detected at system initialization, and afterthe appropriate control register field(s) are set, the configurationwill not be changed.

The timing intervals that are used are shorter than what are present ina typical system. For example, the ACT to RD command spacing (tRCD) isshown as 6.25 ns, but could be e.g. about 12.5 ns in other embodiments.This compression of the timing scale is done for clarity, and does notaffect the technical accuracy; the pipeline timing works equally wellwith a tRCD delay of 6.25 ns.

The tBUF-CA interval (0.93 ns) is the propagation delay needed by theRCD buffer component to retransmit the information on the primary CAlinks to the secondary CA links. The tRL interval (3.125 ns) is thecolumn read delay between the RD command and the read data needed by theDRAM. The tBUF-DQ (0.93 ns) interval does not appear in this examplebecause the DRAM components have a direct primary connection to thecontroller. In other one-module configurations this propagation delaycould be present if a DRAM component needs to transfer its data throughanother DRAM component on module 505 y. The diagram for writetransactions would be similar, but with different fixed timing positionsof commands and data. Each transaction performs a random row activationand column access on each 64 bytes (“36×16b”). Other transactiongranularities are possible.

There are 576 bits forming each 64 byte transfer block. The extra 64bits allow for the transfer and storage of a checksum for an EDC (errordetection and correction) code. If there are bank conflicts in thetransaction stream, and if the transaction stream switches between readand write operations, then data slots will need to be skipped. This formof bandwidth inefficiency is common in memory systems. No additionalresource conflicts are introduced by the modifications that have beenmade to this improved memory system.

Returning to FIG. 5D, the “x” and “y” transactions begin with anactivation command “A” on the CAy bus. The CAx bus is not used in thisconfiguration. These buses have a point-to-point topology and asignaling rate of 1.6 GB/s (one-quarter the signaling rate of thepoint-to-point DQ buses). RCD buffer component 415 y receives theprimary CAy bus and retransmits the information on the CAyb and CAyamodule buses. The CA module buses operate at 0.8 Gb/s, half the speed ofthe primary CA buses and ⅛th the speed of the primary DQ buses. This isbecause the module CA buses have a multi-drop topology; each of themodule CA buses connects to half of the DRAM components on the module.The “ya” and “yb” transactions continue with a read command “R” on theCAy bus. This is retransmitted on the CAyb and CAya module buses. Thetwo read transactions have accessed the two DRAM components 100 ya and100 ya that respectively connect to the nibble-wide primary link groupsDQv and DQu. Where each package contains a stack of DRAM die, eachtransaction accesses the memory in one die in each component.

The “yb” transaction accesses the lower DRAM component 100 yb in thisexample. (DRAM components 100 with multiple DRAM dies may be referred toas a DRAM “stack”). This means that the read data will be driven ontoprimary links DQt, through continuity module 525 x, and then to thecontroller on primary links DQu. The incremental propagation time of the“yb” read data through the continuity module is small enough that it canbe absorbed in the clock skew management circuitry, so the read data onlink groups DQu and DQv arrive at the controller at approximately thesame time.

FIG. 5E depicts system 500 of FIG. 5A but illustrates how the interfacelogic can accommodate direct transfers between two DRAM components onthe same module. FIG. 5F shows the waveforms of the various CA and DQlinks, and also indicates the nominal signaling rate of those buses inaccordance with one embodiment. Each direct transfer operation involvesa read transaction in one DRAM component 100 and a write transaction inanother component 100 on the same module 505. Transactions can becarried out simultaneously on each module, so that four transactionstake place, twice as many as in the read transaction examples of FIGS.5A-5D.

Each of the two read transactions includes an activate command (labeled“A” or “ACT”), a read command (labeled “R” or “RD”), and read data(labeled “36×16b”). Each of the two write transactions includes anactivate command (labeled “A” or “ACT”), a write command (labeled “W” or“WR”), and write data (labeled “36×16b”). In this case, the write dataresults from the read transaction. The timing of the write transaction(tWL) is configured to approximately match the read transaction (tRL)with respect to the interval from the column command to the column date.The data is transferred on the shared DQ bus between the DRAM components(link groups DQyab and DQxab in this case).

The timing may be described as “approximately” matching to recognizethat each DRAM component 100 will accommodate a small amount ofvariability in the timing of its interface. This is because the positionof the receive data and transmit data will drift over a small rangeduring system operation. Interfaces 105 accommodate this dynamic drift,with the result that any drift (within the allowed range) will notaffect the operation of the memory system.

When the command-to-data interval for a write operation matches a readoperation, controller component 510 accounts for the bank usage when atransfer transaction or a write transaction to a DRAM component 100 isfollowed by a read transaction to the same DRAM component. This resourcemanagement is a common function of memory controllers.

The commands and data for each transaction are pipelined. This meansthat they occupy fixed timing positions with respect to the transaction,and it also means that the transactions overlap other transactions. Thetiming intervals are shorter than what are present in a typical system.For example, the ACT to RD command spacing (tRCD) is shown as 6.25 ns,but would be about 12.5 ns for a real DRAM component. This compressionof the timing scale is done for clarity, and does not affect thetechnical accuracy; the pipeline timing works equally well with a tRCDdelay of 6.25 ns.

The tBUF-CA interval (0.93 ns) is the propagation delay needed by theRCD buffer component 415 to retransmit the information on the primary CAlinks to the secondary CA links. The tRL interval (3.125 ns) is thecolumn read delay between the RD command and the read data needed by theDRAM component 100. The tBUF-DQ (0.93 ns) interval does not appear inthis example because each DRAM read package has a direct connection tothe DRAM write component destination. In other configurations thispropagation delay could be present if a DRAM read component transfersdata through another DRAM component on the module to the DRAM writecomponent destination.

The transaction granularity that is shown is 64 bytes; that is, thereare enough command slots to allow each slot of primary link groups DQuand DQv to be filled with data. Each transaction performs a random rowactivation and column access on each 64 bytes (“36×16b”). Othertransaction granularities are possible. Each byte is assumed to be 9b insize in this example. The ninth bit accounts for the checksum of an EDC(error detection and correction) code.

Returning to the waveform diagram, it can be seen that the “x” and “y”transactions begin with an activation command “A” on the CAx and CAybuses. These buses have a point-to-point topology and a signaling rateof 1.6 GB/s (one-quarter the signaling rate of the point-to-point DQbuses). Each RCD buffer components 415 x and 415 y receives the primaryCA bus and retransmits the information on the CAxa, CAxb, CAya, and CAybmodule buses. All four of the CA module buses are used for the transfertransaction.

The CA module buses operate at 0.8 Gb/s, half the speed of the primaryCA buses and ⅛th the speed of the primary DQ buses. This is because themodule CA buses have a multi-drop topology; each of the four module CAbuses connects to about ¼ of the DRAM components on the module. The “x”and “y” transactions continue with two read commands “R” and two writecommands “W” on the CAx and CAy buses. This is retransmitted as two readcommands “RD” and two write commands “WR” on the CAxa, CAxb, Cya, andCAyb buses. The two read transactions have accessed two DRAM components100 xa and 100 ya, and the two write transactions have accessed theother two DRAM components 100 xb and 100 yb. The “x” read transactionaccesses the upper DRAM component 100 xa. The read data will be drivenonto secondary links DQxab to the lower DRAM component 100 xb, to bewritten to the selected DRAM die. Likewise, the “y” read transactionaccesses the upper DRAM component 100 ya. The read data will be drivenonto the DQyab primary links to the lower DRAM component 100 yb to bewritten to the selected DRAM die. A different DRAM component 100 wouldbe accessed with a high-order address bit set differently in the CAx andCAy commands. The primary data interfaces associated with link groupsDQu, DQv, and DQt are not used for these transfers; the interfaces 105connected to these link groups can be disabled by e.g. a controlregister field during such transfer operations.

FIG. 5G depicts system 500 of FIG. 5A but illustrates how the interfacelogic can accommodate direct data transfers between DRAM components ondifferent modules. FIG. 5H shows the waveforms of the various CA and DQbuses, and also indicates the nominal signaling rate of those buses inaccordance with one embodiment.

An illustrated transfer operation involves a read transaction in DRAMcomponent 100 yb of module 505 y and a write transaction in DRAMcomponent 100 xb of module 505 x. These transactions can be carried outconcurrently with two additional read transactions, so that fourtransactions take place. Each of the three read transactions includes anactivate command (labeled “A” or “ACT”), a read command (labeled “R” or“RD”), and read data (labeled “36×16b”). The single write transactionincludes an activate command (labeled “A” or “ACT”), a write command(labeled “W” or “WR”), and write data (labeled “36×16b”).

In this case, the write data results from one of the read transactions.The timing of the write transaction is configured to approximately matchthe read transaction with respect to the interval from the columncommand to the column date. The data is transferred on the shared linkgroup DQt between the two modules.

When the command-to-data interval for a write operation matches a readoperation, controller component 510 accounts for the bank usage when atransfer transaction or a write transaction to a DRAM component 100 isfollowed by a read transaction to the same component. This resourcemanagement is a common function performed by memory controllers. Thecommands and data for each transaction can be pipelined. As in priorexamples, the depicted timing intervals are relatively short.

The tBUF-CA interval (0.93 ns) is the propagation delay needed by theRCD buffer component to retransmit the information on the primary CAlinks to the secondary CA links. The tRL interval (3.125 ns) is thecolumn read delay between the RD command and the read data needed by theDRAM. The tBUF-DQ (0.93 ns) interval does not appear in this examplebecause each DRAM component has a direct connection its destination (tocontroller component 510 or to DRAM write component). In otherconfigurations this propagation delay could be present if a DRAM readcomponent needs to transfer its data through another DRAM component onthe module to the DRAM write component destination.

The transaction granularity that is shown is 64 bytes; that is, thereare enough command slots to allow each of the primary DQu and DQv timeslots to be filled with data. Each transaction performs a random rowactivation and column access on each 64 bytes (“36×16b”). Othertransaction granularities are possible.

There are 576 bits forming each 64 byte transfer block, which allow anextra eight bytes for the transfer and storage of a checksum for an EDC(error detection and correction) code. The “x” and “y” transactionsbegin with a activation command “A” on the CAx and CAy buses. Thesebuses have a point-to-point topology and a signaling rate of 1.6 GB/s(one-quarter the signaling rate of the point-to-point DQ buses). Addressbuffer components 415 x and 415 y each receives the same primary CAinformation and retransmits the information on the CAxa, CAxb, CAya, andCAyb module buses. Alternatively, the primary CA information can bedifferent to activate and address difference locations on modules 505 xand 505 y. All four of the CA module buses will be used for the transfertransaction.

The CA module buses operate at 0.8 Gb/s, half the speed of the primaryCA buses and ⅛th the speed of the primary DQ buses. This is because themodule CA buses have a multi-drop topology; each of the module CA busesconnects to half of the DRAM components on the module. The “x” and “y”transactions continue with three read commands “R” and one write command“W” on the CAx and CAy buses. This is retransmitted as three readcommands “RD” and one write command “WR” on the CAxa, CAxb, CAya, andCAyb buses. The three read transactions have accessed three of the fourDRAM components, and the write transaction has accessed the other DRAMcomponent in this example.

The figure shows one of the nine sets of DRAM components 100 a/100 b oneach module. The four transactions have each accessed one of the DRAMcomponents in each set. In the case of an access to the primary DRAMcomponent, some additional delay will be added to the access time sothat the read data is transmitted on the primary DQ in the same relativetime slot. This incremental delay makes it easier for the controller tomanage the memory pipeline. The DQxbd and DQybd link groups are notrequired in this example; the involved interface 105 can be disabled bythe command decode logic in the primary DRAM component of each package.

Fault Tolerance

FIG. 5I depicts system 500 of FIG. 5A but illustrates how interfaces 105on components 100 provide routing options that allow modules 505 toroute read and write data around defective data paths. In thisillustration, primary data link group DQu between controller component510 and module 505 x is defective (denoted by an “X” through the faultylink group). For example, one or more of the constituent data or strobelinks can be compromised by an open or short circuit. Such problems canresult from e.g. manufacturing defects or corrosion. To address thisproblem, system 500 supports a DQu-fault mode in which both modules 505x and 505 y communicate via primary link group DQv.

Module 505 y is coupled directly to the functional link group DQv, andin the DQu-fault mode communicates data as in the normal mode. Module505 x reroutes data around the faulty link group DQu to the functionaldata link group DQv using link group DQt and module 505 y. Latencycounters and configuration data (not shown) in controller component 510are updated to reflect the fact that the missing data connection slowsthe communication of data, and to configure controller component 510 tosteer and assemble the data signals as needed to comply with e.g. errorcorrection supported in both modes. These changes can be done infirmware or autonomously by the controller when a fault is detected.Controller component 510 can issue an alert signal identifying thenature and location of the problem. System 500 thus supports alternativerouting that maintains full capacity, albeit at reduced bandwidth, toallow time for repair.

Controller component 510 includes a mode register 550 that stores avalue indicative of the fault or faults. Each buffer component 415 x and415 y likewise includes a respective register 555 x and 555 y thatcontroller component 510 loads e.g. during initialization to configuremodules 505 x and 505 y to respond appropriately to read and writecommands. The values in registers 550, 555 x, and 555 y can route dataaround all nine of link groups DQu, or can separately control the linkgroups associated with each link-group pair. Support for the latter caseis more complex, but affords more rerouting flexibility (e.g., onelink-group pair can use link group DQu and another link group DQv).

Mode registers 555 x and 555 y control respective buffer components 415x and 415 y to direct data through respective package data interfaces507 x and 507 y. In normal mode, package data interfaces 507 x and 507 ycommunicate with controller component 510 via respective data ports DQxaand DQya as noted in connection with FIG. 5A. In a DQu-fault mode,package data interface 507 x in module 505 x disables the data port DQxaconnected to the faulty primary link group DQu, and thereaftercommunicates via second data port DQxc and primary link group DQt. Datafrom module 505 x is thus communicated with controller component 510 viadata interface 507 y of module 505 y and the functional primary linkgroup DQv.

FIG. 5J is a timing diagram detailing a read transaction for system 500of FIG. 5I. The signaling rates are as noted previously in connectionwith FIG. 5B. Controller component 510 is assumed to have identified thedefective link group DQu and loaded registers 550, 555 x, and 555 yaccordingly. Controller component 510 can employ any of a number ofcommonly known techniques for error detection.

Controller component 510 issues activation commands “A” on the CAx andCAy command buses to initiate a transaction that involves both modules505 x and 505 y. Buffer components 415 x and 415 y receive activatecommands on respective primary busses CAx and CAy and retransmit theinformation on the CAxa/CAxb and CAya/CAyb module buses. The examplebeing a read transaction, the “x” and “y” transactions includes anactivate command “A” followed by a read command “R” on each of thesecondary CAx and CAy buses. The two read transactions access two of thefour DRAM components, components 100 ya and 100 xb, in this example. The“y” transaction accesses component 100 ya, which drives read data ontothe DQv primary links via port DQya. The “x” transaction accessescomponent 100 xb, the read data from which is driven onto data portDQxc. To bypass defective link group DQu, the read data from port DQxcis communicated to port DQyc of module 505 y via primary link group DQt.DRAM components 100 yb and 100 ya then convey the read data tocontroller component 510 via link group DQv.

The read data from DRAM component 100 xb follows the read data from DRAMcomponent 100 ya in the next time slot for link group DQv. Eachtransaction performs a row activation and column access to deliver 72bytes (36×16b) of data. At the direction of buffer component 415 y,module 505 y adds an incremental delay to the data from module 505 x sothe respective sets of read data from modules 505 y and 505 x arrive atcontroller component 510 in successive time slots.

FIG. 5K is similar to FIG. 5I, illustrating how data can be routed toand from DRAM components 100 xa and 100 yb via primary link group DQv inthe DQu-fault mode. Package data interface 507 x routes data to and fromDRAM component 100 xa via DRAM component 100 xb, the latter of whichcommunicates with controller component 510 as detailed above inconnection with FIGS. 5I and 5J. Package data interface 507 y routesdata to and from DRAM component 100 yb via DRAM component 100 ya, thelatter of which communicates with controller component 510 via primarydata link group DQv. Relative to the example of FIGS. 5I and 5J, thedata communicated in this example traverse one additional DRAM component100, and thus experience additional read and write latency to beaccounted for by controller component 505, address-buffer components415, or both.

FIGS. 5L and 5M are similar to FIGS. 5I and 5J, but illustrate howinterfaces 105 can route read and write data around a faulty primarylink group DQv in a second fault mode, the DQv-fault mode, which modules505 x and 505 y enter when designated values are loaded into respectiveregisters 555 x and 555 y. Other than the illustrated connectivity, theoperation of system 500 is as detailed above in connection with FIGS. 5Iand 5J. In summary, the first package data interface 507 x selectivelycommunicates between first data port DQxa and second data port DQxc atthe direction of buffer component 415 x to relay data between module 505y and controller component 510; the second package data interface 507 ydisables third data port DQya—the one connected to the faulty primarylink group DQv—and communicates instead via fourth data port DQyc.

FIG. 5N is similar to FIG. 5L, illustrating how data can be routed toand from DRAM components 100 xa and 100 yb via primary link group DQu inthe DQv-fault mode. As in prior examples, heavy, dashed lines illustratepaths for read data.

FIG. 6A is a diagram 650 depicting elements of interfaces 105 a and 105b that establish a communication path from port DQa to port DQb. Thoughomitted here for brevity, a similar path extends in the oppositedirection. Ports DQa/DQb are alternatively labeled DQ_(IN) and DQ_(OUT)to reflect the direction of signal flow for this example. Strobe portsDQS± on either side are similarly labeled DQS_(IN) and DQS_(OUT).

Much of the circuitry of diagram 650 operates in a clock domain timed toa clock signal CK that accompanies the CA signals. The receiver portion,which includes amplifier 610 and sampler 620, operates in the domain ofthe received strobe DQS_(IN). A pair of multiplexers 645 and 646 withselector inputs MODE_(R) and MODE_(T) driven from e.g. control registerfields selectively introduce a ninety-degree phase shift to adjust thephase relationships between the data and strobe signals for both receiveand transmit blocks. Delay adjustment logic 640 performs thedomain-crossing function between the domain of the receiver and the onetimed to clock signal CK. Logic 640 generates a signal DQS-EN thatestablishes an enable window for the strobe signal in the CK clockdomain upon receipt of a read or write command.

A sampler 655 samples the undelayed and 90° delayed clock signal CK bythe strobe signal DQS_(IN), and the resulting values SKP[1:0] determinehow to adjust the DLY0.5 phase value and DLY123 cycle value from theirinitial value. This determination is performed e.g. on every datatransfer to allow 0 to 4 TCK of misalignment between signals DQS_(IN)and CK to be automatically compensated. A pair of multiplexers intransmitter 635 selectively insert a zero or ninety degree phase shiftin the strobe signal DQS on the transmit side. An output-enable signalOUT-EN from logic 640 produces an enable window for the output driver oftransmitter 635 upon receipt of a read or write command.

FIG. 6B shows the timing relationship of elements of diagram 650 of FIG.6A. Diagram 650 is reproduced at the upper right to identify circuitnodes with signal names. (In general, signal names and their respectivenodes are referred to using the same designation. Whether a givenreference is to a node, port, link, or signal name will be clear incontext.) The top set of waveforms show the DQ_(IN) and DQS_(IN) timingrelationship for the receive domain. When MODE_(R) is one, DQS_(IN) isedge-aligned; DQS_(IN) and DQ_(IN) make transitions which areapproximately aligned (in-phase).

When MODE_(R) is zero, DQS_(IN) is center-aligned; DQS_(IN) and DQ_(IN)make transitions that are not aligned (out-of-phase). The misalignmentis approximately 90°, meaning that DQS_(IN) transitions areapproximately midway between the DQ_(IN) transitions. The componentinterface can receive data with either phase alignment. The centeralignment is typically used for write data, and the edge alignment istypically used for read data. The DRAM component will transfer eitherread or write data from one interface to the other for some of thesystem configurations.

The bottom set of waveforms show the DQ_(OUT) and DQS_(OUT) timingrelationship for the transmit domain. When MODE_(T) is zero, strobesignal DQS_(OUT) is edge-aligned; signals DQS_(OUT) and DQ_(OUT) maketransitions that are approximately in-phase. When MODE_(T) is one,DQS_(OUT) is center-aligned; DQS_(OUT) and DQ_(OUT) make transitionsthat are misaligned by about 90°, meaning that DQS_(OUT) transitions areapproximately midway between the DQ_(OUT) transitions.

The DRAM interface transmits data with either phase alignment. Thecenter alignment is used for write data, and the edge alignment is usedfor read data. The DRAM transfers either read or write data from oneinterface to the other for some of the system configurations, so thismodal configurability is needed.

FIG. 6C shows the second order detail of the domain-crossing logic forthe circuitry of diagram 650 of FIG. 6A. The logic in this example hashad control register fields (not shown) set to specific values toillustrate how the interface could be initially configured andmaintained. Primary data signals DQ_(IN) (the receive domain) is sampledby the primary timing link DQS_(IN) at the rising and falling edges(because MODE_(R)=0, inserting zero degrees of delay into the DQS path).This results in two sampled values Y and Z held on the DQ_(Y0) andDQ_(Z0) register outputs in the DQS domain. Signal DQS-EN is formed inthe CK domain and gates the DQS_(IN) signal, and can be extended if thedata transfer is longer.

This example assumes the DQS and CK signals are aligned so the SKP[1]value sampled from CK+90° by DQS_(IN) is LOW. The DLY0.5 control valuewas set by the SKP[1] value on the previous WR transfer, so it will alsobe low. The low value on the DLY0.5 control causes the DQ_(Y0) andDQ_(Z0) values to be passed through the multiplexers in the phaseadjustment block.

The value on the DLY123[1:0] control is assumed to be 00, which causesthe DQ_(Y0) and DQ_(Z0) values to be passed through the multiplexers incycle adjustment block 630, as well. The DQ_(Y0) and DQ_(Z0) values willbe sampled by the DQ_(Y2) and DQ_(Z2) registers and will have crossedinto the CK domain at this point. The DQ_(Y2) and DQ_(Z2) registersdrive the output multiplexer, which in turn drives the output driver forport DQb.

Logic 640 produces strobe output DQS_(OUT), which is driven using theCK+90° signal when the MODE_(T)=1 value causes 90 degrees of delay to beinserted to the DQS_(OUT) value. If the value on the DLY123[1:0] controlis assumed to be 11, the DQ_(Y0) and DQ_(Z0) values will be delayed by athree-cycle pipeline. The data and timing signals will appear on thesecondary links 3*tCK later than for the previous case. This allows thedelay through the DQS-to-CK domain crossing to be adjusted in one-cycleincrements.

FIG. 6D is similar to FIG. 6C, except that it assumes the DQS_(IN) andCK signals are not aligned so the SKP[1] value sampled from CK+90° byDQS_(IN) is high. The waveforms of six internal nodes are shown in thefigure, along the primary data input and secondary data output signals.Each primary data link DQ_(IN) is sampled by the primary timing linkDQS_(IN) at the rising and falling edges, resulting in two sampledvalues Y and Z held on the DQ_(Y0) and DQ_(Z0) register outputs in theDQS_(IN) domain. The DQS-EN signal is formed in the CK domain and gatesthe DQS_(IN) signal. It will be extended if the data transfer is longer.

A high value on the DLY0.5 control causes the DQ_(Y0) and DQ_(Z0) valuesto be sampled by the DQ_(Y1) and DQ_(Z1) registers and passed throughthe multiplexers in the phase adjustment block. The value on theDLY123[1:0] control is assumed to be 00, which causes the DQ_(Y1) andDQ_(Z1) values to be passed through the multiplexers in the cycleadjustment block. The DQ_(Y1) and DQ_(Z1) values will be sampled by theDQ_(Y2) and DQ_(Z2) registers and will have crossed into the CK domainat this point. The DQ_(Y2) and DQ_(Z2) registers drive the outputmultiplexer, which in turn drives the output driver for the secondarylink group.

Signal DQS_(OUT) is enabled by signal OUT-EN from logic 640, and isdriven using the CK+90° signal, since the MODE_(T)=1. If the value onthe DLY123[1:0] control is assumed to be 11, the DQ_(Y0) and DQ_(Z0)values will be delayed by a three-cycle pipeline. The data and timingsignals appear on the secondary links 3*tCK later than for the previouscase. This allows the delay through the DQS-to-CK domain crossing to beadjusted in one-cycle increments.

FIG. 6E is a waveform diagram illustrating how the timing examples ofFIGS. 6C and 6D can be combined to automatically track drift between theDQSI_(N) and CK domain over an arbitrarily large range. This exampleassumes that the domain-crossing logic has been initialized so the delayfrom a column write command on the CA bus and the write data for thatcommand is a constant 3.00*tCK (these values are smaller than would beseen in an actual system so they will fit in the timing diagram moreeasily).

In the left diagram, the write strobe arrives 1.125*tCK after the writecommand. The SKP[1:0] values that are sampled are “01”. The new DLY0.5phase value is set from SKP[1], and the new DLY123[1:0] cycle value is“01” (the same as what was previously set at initialization). In theright diagram, the DQS_(IN) timing has drifted relative to the CKdomain, so the write strobe arrives 1.375*tCK after the write command.The SKP[1:0] values that are sampled are “11”.

The new DLY0.5 phase value is set from SKP[1]. Because the SKP[1] andthe old DLY0.5 phase value are different, and because SKP[0] is high,the new DLY123[1:0] will increment or decrement (relative to oldDLY123[1:0] value) to keep the command-to-data delay constant at 3.00tCK (it will decrement in this example). In summary, the DQS_(IN) timingsignal for each transfer will sample the CK and CK+90° (in the case of awrite) and retain this information in the SKP[1:0] register.

At the idle interval before the next transfer, the DLY0.5 andDLY123[1:0] values (held in a control register in the CK domain) can beupdated to reflect the SKP[1:0] from the previous transfer. These newDLY0.5 and DLY123[1:0] values are used on the next transfer. Thissequence will happen automatically on each transfer, and will allow thedomain-crossing logic to accommodate an arbitrarily large range ofDQS-to-CK drift during system operation. After an initialization processgets the control registers set to appropriate values, no furthermaintenance operations are required to support this automatic tracking.

In the foregoing description and in the accompanying drawings, specificterminology and drawing symbols have been set forth to provide athorough understanding of the present invention. In some instances, theterminology and symbols may imply specific details that are not requiredto practice the invention.

For example, any of the specific numbers of bits, signal path widths,signaling or operating frequencies, component circuits or devices andthe like may be different from those described above in alternativeembodiments. Also, the interconnection between circuit elements orcircuit blocks shown or described as multi-conductor signal links mayalternatively be single-conductor signal links, and single conductorsignal links may alternatively be multi-conductor signal links. Signalsand signaling paths shown or described as being single-ended may also bedifferential, and vice-versa. Similarly, signals described or depictedas having active-high or active-low logic levels may have opposite logiclevels in alternative embodiments.

The term “memory” refers to electronic data storage systems, packages,devices, and collections of packages and devices used in computers.Computer memory commonly stores bits of binary data in arrays of memorycells form on an integrated circuit (IC) die and arranged in rows andcolumns. Component circuitry within these dies can be implemented usingmetal oxide semiconductor (MOS) technology, bipolar technology or anyother technology in which logical and analog circuits may beimplemented.

With respect to terminology, a signal is said to be “asserted” when thesignal is driven to a low or high logic state (or charged to a highlogic state or discharged to a low logic state) to indicate a particularcondition. Conversely, a signal is said to be “de-asserted” to indicatethat the signal is driven (or charged or discharged) to a state otherthan the asserted state (including a high or low logic state, or thefloating state that may occur when the signal driving circuit istransitioned to a high impedance condition, such as an open drain oropen collector condition).

A signal driving circuit is said to “output” a signal to a signalreceiving circuit when the signal driving circuit asserts (orde-asserts, if explicitly stated or indicated by context) the signal ona signal line coupled between the signal driving and signal receivingcircuits. A line over a signal name is also used to indicate an activelow signal. The term “coupled” is used herein to express a directconnection as well as a connection through one or more interveningcircuits or structures.

Integrated circuit device “programming” may include, for example andwithout limitation, loading a control value into a register or otherstorage circuit within the device in response to a host instruction andthus controlling an operational aspect of the device, establishing adevice configuration or controlling an operational aspect of the devicethrough a one-time programming operation (e.g., blowing fuses within aconfiguration circuit during device production), and/or connecting oneor more selected pins or other contact structures of the device toreference voltage lines (also referred to as strapping) to establish aparticular device configuration or operation aspect of the device. Theterm “exemplary” is used to express an example, not a preference orrequirement. For these and other reasons, the spirit and scope of theappended claims should not be limited to the foregoing description.Moreover, only those claims specifically reciting “means for” or “stepfor” should be construed in the manner required under the sixthparagraph of 35 U.S.C. §112.

What is claimed is:
 1. A memory system supporting a normal mode and afault mode, the memory system comprising: a controller component; afirst data link extending from the controller component; a second datalink electrically isolated from the controller component; a first memorymodule having a first dynamic, random-access memory (DRAM) package andsupporting the normal mode and the fault mode, the first DRAM packageincluding: a first data port coupled to the controller component via thefirst data link; a second data port coupled to the second data link; anda first package data interface coupled to the first data port and thesecond data port, the first package data interface disabling the firstdata port and communicating via the second data port in the fault mode;a third data link extending from the controller component; a secondmemory module having a second DRAM package and supporting the normalmode and the fault mode, the second DRAM package including: a third dataport coupled to the controller component via the third data link; afourth data port coupled to the second data link electrically isolatedfrom the controller component; and a second package data interfaceselectively communicating between the third data port and the fourthdata port in the fault mode.
 2. The memory system of claim 1, furthersupporting a second fault mode, wherein the first package data interfaceselectively communicates between the first data port and the second dataport in the second fault mode.
 3. The memory system of claim 2, whereinthe second package data interface disables the third data port andcommunicates via the fourth data port in the second fault mode.
 4. Thememory system of claim 1, wherein the first DRAM package includes afirst DRAM component and a second DRAM component.
 5. The memory systemof claim 4, wherein: the first DRAM component includes a first componentinterface, coupled to the first data port, and a second componentinterface; and the second DRAM component includes a third componentinterface, coupled to the second data port, and a fourth componentinterface coupled to the second component interface.
 6. The memorysystem of claim 4, wherein the first DRAM component includes multipleDRAM dies.
 7. The memory system of claim 4, the first memory modulefurther having a buffer component having a primary command interface, afirst secondary command interface coupled to the first DRAM component,and a second secondary command interface coupled to the second DRAMcomponent.
 8. The memory system of claim 7, wherein the buffer componentincludes a mode register to store a value indicative of one of thenormal mode and the fault mode.
 9. The memory system of claim 1, whereinthe controller component includes a register to store a value indicativeof the normal mode or the fault mode.
 10. A memory module supporting anormal mode and a fault mode, the memory module comprising: a memorypackage including: a first data port; a second data port; and a packagedata interface coupled to the first data port and the second data port,the package data interface disabling the first data port and enablingthe second data port in the normal mode, and enabling the first dataport and disabling the second data port in the fault mode.
 11. Thememory module of claim 10, further comprising a mode register to store amode value indicative of one of the normal mode and the fault mode. 12.The memory module of claim 10, further comprising a buffer component,coupled to the memory package, the buffer component to receive primarymemory commands, derive secondary memory commands from the primarymemory commands, and issue the secondary memory commands to the memorypackage.
 13. The memory module of claim 10, wherein the memory packagefurther includes: a first memory component having a first componentinterface, coupled to the first data port, and a second componentinterface; and a second memory component having a third componentinterface, coupled to the second data port, and a fourth componentinterface coupled to the second component interface.
 14. The memorymodule of claim 13, wherein the first memory component includes memorydies.
 15. The memory module of claim 13, further comprising a buffercomponent, coupled to the first memory component and the second memorycomponent, the buffer component to receive primary memory commands,derive secondary memory commands from the primary memory commands, andissue separate secondary memory commands to the first memory componentand the second memory component.
 16. The memory module of claim 15, thebuffer component including a mode register to store a value indicativeof one of the normal mode and the fault mode.
 17. A memory systemsupporting a normal mode and a fault mode, the memory system comprising:a controller component; a first data link extending from the controllercomponent; a second data link electrically isolated from the controllercomponent; a first memory module having first memory supporting thenormal mode and the fault mode, the first memory including: a first dataport coupled to the controller component via the first data link; asecond data port coupled to the second data link; and means fordisabling the first data port and communicating via the second data portin the fault mode; a third data link extending from the controllercomponent; a second memory module having a second memory supporting thenormal mode and the fault mode, the second memory including: a thirddata port coupled to the controller component via the third data link; afourth data port coupled to the second data link electrically isolatedfrom the controller component; and means for relaying data between thecontroller component and the first memory module via the second datalink in the fault mode.
 18. The memory system of claim 17, furthersupporting a second fault mode, wherein the means for disabling thefirst data port relays data between the controller component and thesecond memory module via the second data link in the second fault mode.19. The memory system of claim 18, wherein the means for relaying databetween the controller component and the first memory module via thesecond data link disables the third data port and communicates via thefourth data port in the second fault mode.
 20. The memory system ofclaim 17, the first memory module further comprising means for storing avalue indicative of one of the normal mode and the fault mode.